Registration for the 2021 T&I Summit is FREE for members!


The 4th annual, completely online T&I Summit centers around the theme, "Creating business value in the China ecosystem". In 2021, technology is dramatically widening profitability and performance gaps between companies across the competitive landscape. Today's tech-driven business strategies increasingly call for an end-to-end ecosystem strategy, but this is challenging both globally and in the evolving China market.


The Technology and Innovation Summit is an annual signature event launched in 2018 under AmCham China's Technology and Innovation Initiative​. This full-day conference is a valuable platform for corporations to exchange cross-sector best practices and innovative solutions for the business application of disruptive technologies in varied industries and corporate functions.


Agenda Highlights (off the record, English and Chinese with closed caption translation)

  • Digital transformation dialogue withAlain Benichou, CEO of IBM Greater China Group, and Alan Beebe, President of AmCham China
  • Keynote on "Sustainability and Tech" from Dr. Hsiao-Wuen Hon, Corporate Vice President of Microsoft Asia-Pacific R&D Group
  • Keynote on "Creating a digital-first organization to unlock exponential scaling" from Yan Han, Founder, Chairman, Chief Editor of Cheers Publishing
  • Dr. Jian Lu, President of LinkedIn China, leads the CEO Panel on "The shift to hybrid work: preparing for the business and social impact"
  • Gang Lu, Founder & CEO of Technode & Technode Global, leads the CMO Panel on "Global digital engagement strategies"
  • Herbert Chia, Author of "Data Reinvention" and Sequoia China Partner, leads the CTO Panel on "Reinventing the technology stack and data operations in China"


The virtual Summit will be hosted via a direct access URL sent to all registrants, it is recommended to use Chrome browser to optimize viewing experience.


Plus, AmCham China and Cheers Publishing have partnered to give away 100 free digital downloads of Herbert Chia's "Data Reinvention" (Chinese language only) to Summit attendees. The Summit link and book download link will be sent to registrants on September 22, 2021.

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